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PIC International 2026

On top of countless high-valued speakers, we are glad announcing also a contribution by Polariton.

Enabling THz Bandwidth on-chip with Plasmonic Modulators

High-speed modulation is a materials race. While silicon photonics is reaching its natural limit, its performance can be conveniently boosted with the addition of advanced materials. Plasmonics offers a monolithic approach with manufacturing steps similar to standard redistribution layer post-processing. This technology avoids complex layer stacks, intricate alignment, and heterogeneous material bonding; moreover, it is scalable to 300 mm wafers. It has been proven effective in the THz regime, making it sufficient for 400G, 800G, and 1.6T per-lane optical communication.

Where: Sheraton Hotel, Brussels Airport, Belgium

When: Apr 20 – 22, 2026

Our team:

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