February 04, 2026
Zurich, Switzerland

Polariton, a technology leader in optical connectivity for next-generation communication infrastructure, announces today the shipping of high-speed silicon photonics transmit chips, enhanced with its proprietary , to three leading transceiver manufacturers.

This demonstrates the commercial interest in this technology, which is built to power AI connectivity, alleviate the interconnect bottleneck, and meet the requirements of hyperscale datacenters. Silicon photonics is widely used in communication networks around the globe, and more recently the industry is going through an unprecedented growth determined by the demand for AI-based applications. The adoption rate of new transceiver generations has increased and plasmonics is positioned to drive data connectivity to the next level with an architecture that addresses speed, scalable manufacturing and power efficiency.

With the foreseeable introduction of 3.2T products and CPO implementations, Polariton is hitting the nail on the head by addressing higher speed and power reduction at the same time.

“Delivering samples to industry leaders is the best market proof we can think of. The devices are inherently capable to support 400G per lane operation and customers are now integrating Polariton’s chips across their ecosystem”, commented Claudia Hoessbacher, CEO of Polariton. “We are seeing robust engagement with existing and new customers alike and are looking forward to showcasing the in Los Angeles in March”.

About Polariton Technologies

Polariton is a Swiss designer and manufacturer of high-performance photonic integrated circuits (PICs) for ultra-high-bandwidth and low-power applications in communication, computing, test & measurement, space and quantum technologies markets. Exceptional performance is achieved by combining the established silicon photonics platform with plasmonic active devices enabling operation in THz regimes.