Hamit received his B.S. and M.S. degrees in electrical engineering from ETH Zurich, Switzerland in 1988 after which he worked as a scientist and Ph.D. student at the Institute for Quantum Electronics (Prof. Dr. H. Melchior) with focus on the development of advanced integrated circuits and packages for optoelectronic communication applications.”
In 1995, he joined the Institute for Business and Production Management (BWI) at ETH Zurich. Switzerland, where he worked as post-doc on chip-on-board and multichip module technology and conducted post-graduate studies in business and production management.
Since 1997, he has worked for different companies in Switzerland, Germany and the US, amongst them Philips Semiconductors, ABB Semiconductors, Texas Instruments and Huawei Technologies where he focused on the development of advanced semiconductor packages.
From 2012 until 2014, he was Chapter Chair of the IEEE Switzerland CPMT Chapter (now IEEE Electronics Packaging Society Chapter).
Hamit joined Polariton in August 2020 as a Senior Packaging Engineer developing the next generation of high-speed electro-optic plasmonic modulator modules.